Diamond heat sink future direction of possible applications

1.High power fibre laser - laser cutting, laser welding and other uses - corresponding to high-power semiconductor chips one of the largest heat sink application market, high power needs a strong heat sink to improve the stability and performance of the product

2.High-speed optical communication module - corresponding to high-power DFB, EML chip - super heat sink, chip durable high-speed optical modules and Narrow Linewidth Lasers and other products, due to the rate is rising, power consumption continues to improve the need for strong heat dissipation materials.

a. 800G-100GEML * 8/200GEML * 4 

b. ELSFP-8 * high-power CWDFB chip 

c. Silicon optical module high-power CWDFB chip 

d. CPO module, due to its use of 2.5D package, the Line density is a lot, so the need for stronger heat dissipation capabilities, while the recent release of Huawei's TSV + diamond applications can also be migrated to this, we believe that the diamond's superior heat dissipation capabilities can River products to significantly reduce power consumption. 

3. laser projection - corresponding to the high-power visible laser chip laser TV - high-power visible light chip - domestic laser TV, super heat dissipation, chip durability, brightness attenuation Small

4.Power semiconductor (IGBT, etc., oversized market, I'll update the follow-up)

5.LIDAR - corresponding to high-power VCSEL chip and high-power 905-EEL chip - super heat dissipation, reduce temperature drift 

6.Automotive laser headlamps - corresponding to the high-power laser chip and high-power LED chip, super headlamps, long-lasting durability, automotive diamond quality.